黑人无码激情,黄色污污网站欧美,一本加勒比HEZYO东京,日韩中出AV

NAND MCP Memory Multiple Chip Package (MCP) stacks multiple chips into a single package, offering increased spatial density and performance benefits, while reducing overall power consumption. This enables designers to pack more functionality into a smaller form factor, facilitating the development of smaller electronic devices.

Embedded Multi Chip Package （eMCP） eMCP embedded multi chip package (eMMC + Multi Chip Package), eMMC combined with MCP package, compared with the traditional MCP, Flash control chip NAND eMCP, can be more effective management of large capacity flash memory, and reduce the burden of the main chip operation